Technologies

Intel’s 2024 PC Chips Getting a Speed Boost From New Power Tech

PowerVia should speed up Intel PC chips — and maybe even rival designs if Intel can persuade competitors to use its manufacturing services.

Intel’s Arrow Lake processor for 2024 PCs will get a speed boost thanks to a new technique sending electrical power through its chips.

In tests detailed Monday, Intel said a technology it calls PowerVia offered a 6% speed boost on test chips. Another big change called RibbonFET that’s coming with Arrow Lake should offer further advantages.

That’s a big deal for Intel, which has struggled to reclaim a once formidable chipmaking advantage that it lost to Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung. Those two companies are «foundry» companies that make other chips, notably Intel’s top competitors: Apple, AMD, Nvidia and Qualcomm, but they aren’t expected to match PowerVia until later.

If PowerVia and RibbonFET arrive on time in 2024 with the Intel 20A manufacturing process, then are improved with 18A in 2025, it could help Intel better match rival chips when it comes to packing in lots of circuitry and running efficiently to extend battery life. Apple’s MacBook laptops run unplugged for hours, and many models completely do away with a cooling fan to keep their chips from overheating.

«It looks like a good incremental step,» but not a permanent advantage for Intel, Tirias Research analyst Kevin Krewell said of PowerVia. «Everybody’s going to follow suit and will have the same technology in place over time.»

And because Intel is trying to become a foundry too, it could mean some of those competitors actually could become customers that, like Intel’s own chips, benefit. Intel missed out on making smartphone chips, but in Intel’s ideal future, it could be building the Apple processor that powers a future iPhone.

Meet backside power delivery

Chips process data and perform calculations using tiny electrical switches called transistors that can switch on and off billions of times per second. Today, the necessary power to do that comes on equally tiny electrical links that wind their way through a complex 3D labyrinth of wires that also carry instruction signals to the transistors.

But with Arrow Lake, the 2024 successor to this year’s Meteor Lake processor for PCs, Intel will separate the power delivery from the communication links, moving it to the opposite face of the chip. In the semiconductor industry, it’s called a backside power delivery network, but Intel calls its version PowerVia.

«PowerVia is a revolutionary change for on-chip interconnects that improves power, performance, area, and cost,» all important dimensions of transistor design, said Ben Sell, an Intel vice president who worked on the technology.

Problems with manufacturing progress

By incorporating PowerVia in its highest volume, highest profile processor, Intel is counting on backside power delivery working well and not degrading manufacturing with flawed chips. To guard against that possible disaster, Intel developed PowerVia using test chips built with its current Intel 4 manufacturing process, used to make elements of Meteor Lake. It works well enough that it’ll be standard for Intel 20A and its successor, 18A.

PowerVia is a crucial element to Intel’s recovery effort. In the relentless effort to miniaturize transistors, to keep pace with Moore’s Law, Intel faltered a decade ago and hasn’t fully recovered. Although Samsung and TSMC are working on backside power delivery, PowerVia could beat it to market. For example, TSMC’s backside power technology isn’t expected until 2026.

«From everything we know, this is coming a node ahead of what the industry is doing and gives our customers the advantages of PowerVia as soon as possible,» Sell said. A node is a major step in chip manufacturing technology.

PowerVia adds new processing steps to the hundreds already required to make a chip. Once the transistors are carefully built on the front of a silicon wafer of chips, the wafer must be flipped over, ground thinner, polished, and have power connections installed.

That adds cost and time. But removing the power lines from the front of the wafer means there’s more room for communication links, simplifying designs and overall lowers manufacturing costs.

Technologies

Today’s NYT Mini Crossword Answers for Wednesday, March 11

Here are the answers for The New York Times Mini Crossword for March 11.

Looking for the most recent Mini Crossword answer? Click here for today’s Mini Crossword hints, as well as our daily answers and hints for The New York Times Wordle, Strands, Connections and Connections: Sports Edition puzzles.

Need some help with today’s Mini Crossword? I thought it was a bit tricky. 1-Down is one of those old-fashioned comic-book sounds that I had to remember how to spell correctly. Read on for all the answers. And if you could use some hints and guidance for daily solving, check out our Mini Crossword tips.

If you’re looking for today’s Wordle, Connections, Connections: Sports Edition and Strands answers, you can visit CNET’s NYT puzzle hints page.

Read more: Tips and Tricks for Solving The New York Times Mini Crossword

Let’s get to those Mini Crossword clues and answers.

Mini across clues and answers

1A clue: Study of the human mind, informally
Answer: PSYCH

6A clue: Common fixture in a gym bathroom
Answer: SCALE

7A clue: Kinda boring
Answer: HOHUM

8A clue: Like a commenter without a username, for short
Answer: ANON

9A clue: «All good between us?»
Answer: WEOK

Mini down clues and answers

1D clue: Old-fashioned «Yeah, right!»
Answer: PSHAW

2D clue: Coffeehouse pastry
Answer: SCONE

3D clue: Google alternative
Answer: YAHOO

4D clue: Sound of a dull thump
Answer: CLUNK

5D clue: Line on the bottom of a pant leg
Answer: HEM

Technologies

OnePlus and Oppo to Raise Smartphone Prices as Memory Costs Climb

Oppo says rising costs for key phone components will trigger price adjustments on some devices starting March 16.

Chinese smartphone-makers OnePlus and Oppo plan to raise prices on some existing models starting next week, according to a 9to5Google report citing GizmoChina and a notice posted on Oppo’s China online store.

In its notice, Oppo said it would adjust pricing after evaluating rising costs for several key components used in its mobile phones. The changes are expected to take effect around March 16 and will affect some of the company’s more affordable smartphones, as well as some OnePlus models.

Flagship devices — like those in the Find and Reno series — are not expected to be affected for now. The reported adjustments currently appear to be limited to China.

The move highlights growing pressure across the smartphone supply chain as component costs climb. Analysts say prices for memory and storage chips used in phones have been rising in recent months as demand surges across the tech industry.

Much of the chip demand is coming from the rapid buildout of AI data centers, which rely on large amounts of high-performance memory.

That pressure isn’t limited to Oppo and OnePlus. Analysts say smartphone brands across the industry are facing rising component costs amid increased demand for memory chips.

As manufacturers shift production toward higher-margin memory used in AI servers, supply for consumer electronics such as smartphones and laptops can tighten.

If component costs continue to rise, manufacturers may face difficult choices later this year, including raising retail prices or adjusting device specifications to offset higher manufacturing costs.

OnePlus and Oppo didn’t immediately respond to a request for comment.

Technologies

Harvard Business Review Study Finds ‘AI Brain Fry’ Is Leaving Workers Mentally Fatigued

Study participants reported increased mental fatigue while using AI tools, but less burnout overall.

Workers who excessively use AI agents and tools at work are at increased risk of mental fatigue, according to a recent Harvard Business Review study. In certain industries, more than 25% of hired professionals report increased mental strain due to their role in AI oversight — though these professionals also generally experienced less burnout than peers who aren’t using AI.

This phenomenon — which the researchers refer to as «AI brain fry» — is described as a «‘buzzing’ feeling or a mental fog» that caused study participants to develop headaches and difficulty focusing and making decisions. Individuals pointed to being overwhelmed by large amounts of information and to frequent task switching as the reasons for these feelings.

Studied individuals experienced more brain fry when they utilized AI agents to manage a workload beyond their own cognitive capacity. When participants used AI to replace mundane, repetitive tasks, managing the growing number of tools led to increased mental fatigue.

Crucially, the study found that fewer individuals who used these AI agents reported workplace burnout.

The researchers predict that this is because burnout testing assesses emotional and physical distress. In contrast, they report, acute mental fatigue «is caused by marshalling attention, working memory and executive control beyond the limited capacity of these systems.»

These are the processes that are taxed when study participants use multiple AI tools in their workflow, according to the researchers.

The Harvard study identifies several business costs incurred by workers suffering from AI brain fry. The foremost consequence is that these individuals may end up making lower-quality decisions. «Workers in [the] study who endorsed AI brain fry experience 33% more decision fatigue than those who did not,» the study reports. Workers who report AI brain fry were also more likely to self-report making both minor and major errors at their jobs.

Another recent Harvard Business Review study similarly found that employees who use AI tools «worked at a faster pace, took on a broader scope of tasks and extended work into more hours of the day,» but warned that «workload creep can in turn lead to cognitive fatigue, burnout and weakened decision-making.»